The chuck that holds the wafer in wet-clean equipment
Spin Chuck
Overview
Holding its shape in a corrosive environment
Used for front and back surface processing on 300 mm and 200 mm lines. New chucks and materials can be developed around the customer's chemicals and equipment.
OEM
We produce and supply core wet-clean parts to global top-leading semiconductor equipment makers.
ODM
Built on the OEM know-how accumulated in semiconductor wet-clean equipment, we also produce and supply on an ODM basis.
Reverse Engineering
Our own material analysis and reverse-engineering capability lets us repair a spin chuck.
45℃ ~ 220℃, compatible with process chemicals
Production Reference · based on parts already supplied.
- Service Temp.45℃ ~ 220℃
- Base MaterialEngineering Plastic (PEEK, PVC, etc.) · Non-ferrous (AL, SUS, etc.)
- ChemicalHF, SC1, SPM, LPSPM, DSP, DHF, LAL, POLY, T-dryer, ESC (organic), O3HF, O3DIW
Other chemicals can be reviewed against the customer's process conditions.
