
Total Package Part Solution for semiconductor equipment
New value in semiconductors, built by ultra-precision technology
End-to-end precision process solutions and outstanding equipment technology set a new standard for the global semiconductor industry.
Our products
Four core parts for the wet-clean process, made in house from design through machining, assembly and inspection.

LED Heating System
Heating the wafer with light
Twelve individually controlled channels hold uniformity within ±3% and reach up to 400℃.

MC-PFA
Carbon PFA you can injection mould
High-purity PFA combined with the conductivity of carbon and injection mouldability. Forming instead of cutting reduces material loss, and no metal ions were detected after SPM immersion.

Spin Chuck
Holding its shape in a corrosive environment
The chuck that holds the wafer on 300 mm and 200 mm lines. 45℃ to 220℃, twelve chemicals.

Chamber Parts
Plastic components inside the cleaning chamber
Our engineering-plastic machining covers bowls, vats, chemical tanks, dampers and other cleaning-chamber components. Material loss is kept to a minimum, which keeps the price reasonable.








